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| Brand Name: | Soeteck |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
AI training clusters and high-performance computing (HPC) workloads push rack densities far beyond what conventional room cooling was ever designed for. The 24-Cabinet AI-Ready Modular Data Center answers that challenge as a single prefabricated, rapidly deployable module: twenty-four 42U cabinets housed in one 8400 x 3600 x 2000 mm enclosure, factory-integrated with power, cooling and containment so the hall can be commissioned within days rather than months.
Inside, a Modular N+1 UPS built from 25kVA hot-swappable modules (5+1) feeds the IT load, while four in-row air conditioners deliver 40.9 kW each on a 3+1 redundant scheme. Cold and hot aisle containment, overhead busway and pre-installed cable management keep every rack ready for GPU-class hardware, and the modular building-block design lets you add further modules as compute demand grows, making it a dependable foundation for large language model training and high-density computing.
| Configuration | IT Cabinets | Power / Cab | UPS System | Cooling Capacity | Refrigeration Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| Plan 1 › | 12 Cabinets | 5 kW | 90K Rack Modular (15kVA modules, 4+1) |
25.5kW x 4 (3+1 Redundancy) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 2 › | 12 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
65.5kW x 2 (1+1 Redundant) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 3 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
71.1kW x 1 (N Redundancy) |
Room-Level AC | 4800 x 3600 x 2000 mm |
| Plan 4 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
Custom Capacity (Tailored) |
FAN WALL | 4800 x 3600 x 2000 mm |
| Plan 5 › | 18 Cabinets | 5 kW | Modular N+1 (25kVA modules, 4+1) |
31.1kW x 4 (3+1 Redundancy) |
In-Row AC | 6000 x 3600 x 2000 mm |
| Plan 6 › | 24 Cabinets | 5 kW | Modular N+1 (25kVA modules, 5+1) |
40.9kW x 4 (3+1 Redundancy) |
In-Row AC | 8400 x 3600 x 2000 mm |
| Custom › | ≤ 48 Cabinets | ≤ 15 kW | Max 500kVA (2N/N+1 Redundancy) |
Flexible Capacity (Row or Room) |
Air / Water / Chilled | Length ≤ 15000 mm |
Powering Next-Gen Compute: A single module houses 24 x 42U cabinets on a reinforced frame rated for fully loaded GPU servers, with overhead busway, pre-installed cable management and space reserved for liquid-cooling manifolds, so the hall accepts the latest accelerator platforms the day it lands.
Seamless Scalability: Start with one module and add further modules as compute demand grows. Standardized power and cooling interfaces keep every expansion a matter of weeks rather than a facility rebuild, letting air-cooled storage and high-density compute share the same footprint.
Modular N+1 Power: The integrated UPS is built from 25kVA hot-swappable power modules in a 5+1 configuration, so a single module can be replaced on load without dropping the IT bus, protection that matches the step-load behaviour of AI training workloads.
In-Row Cooling: Four in-row air conditioners deliver 40.9 kW each on a 3+1 redundant scheme, removing heat close to its source and holding a stable supply-air temperature even as rack density climbs.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
