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| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
Deploying large-scale AI clusters—like NVIDIA HGX or DGX pods—demands cooling that’s both powerful enough for dense chips and simple enough to manage in hyperscale deployments. When you’re running dozens of high-performance GPUs across hyperscale infrastructure, scattered cooling loops create endless operational headaches: messy piping, hard-to-track maintenance, and inconsistent temperature control across racks—especially for systems requiring robust 50kW heat dissipation and 42U rack compatibility.
Built specifically for hyperscale AI-ready environments, the Cold Plate In Row Hyperscale Container Data Center (42U, 50kW) solves this with a centralized in-row cold plate cooling architecture—all packed into a compact, transportable container. It streamlines facility management for hyperscale deployments while delivering pinpoint thermal control to 42U high-density AI racks, eliminating the complexity of distributed cooling components that slow down deployment and increase downtime risk, with 50kW total cooling capacity to match extreme heat loads.
At its core is in-row cold plate liquid cooling that sends coolant directly to AI chip processors (Direct-to-Chip), pulling heat away from the most critical components efficiently to support the 50kW cooling demand. Integrated air handlers take care of residual heat, creating a seamless, turnkey hyperscale solution optimized for 42U racks that’s ready to support standardized AI training workloads. The containerized design means it’s easy to ship, deploy, and scale—perfect for teams building hyperscale AI infrastructure fast without compromising on cooling reliability, 42U compatibility, or 50kW thermal performance.
| Model | Cooling Architecture | Rack / Tank Count | Max Power Density | Total Capacity | Container Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| 20ft Immersion › | Single-Phase Immersion (Integrated FDU) |
4 Tanks | 100 kW / Tank | 400 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
| 40ft Immersion › | Single-Phase Immersion (Integrated FDU) |
12 Tanks | 100 kW / Tank | 1.2 MW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (In-Row) › | In-Row CDU (Liquid-to-Liquid / Air Assist) |
12 Racks (Space for CDUs) |
60 kW / Rack | 720 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
14 Racks (Maximized Space) |
50 kW / Rack | 700 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 20ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
5 Racks | 50 kW / Rack | 250 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
Designed for hyperscale AI workloads, our direct-to-chip cold plate technology efficiently manages 50kW per 42U rack. This system features a secondary loop with precision flow control and leak-safe redundancy, ensuring that high-performance GPUs and accelerators remain at optimal temperatures. By removing heat directly at the source, it eliminates thermal bottlenecks and maximizes the compute density of your containerized infrastructure.
Designed for hyperscale AI workloads, our direct-to-chip cold plate technology efficiently manages 50kW per 42U rack. This system features a secondary loop with precision flow control and leak-safe redundancy, ensuring that high-performance GPUs and accelerators remain at optimal temperatures. By removing heat directly at the source, it eliminates thermal bottlenecks and maximizes the compute density of your containerized infrastructure.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
