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| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
AI training workloads—especially large language model (LLM) and high-performance computing (HPC) tasks—demand unprecedented levels of computing power, and traditional air-cooled data centers struggle to keep up. They lack the cooling efficiency to handle dense GPU clusters, and their rigid infrastructure limits flexible deployment across different locations—whether urban edge sites, industrial parks, or remote data center hubs—all critical for AI-ready operations.
Built specifically for AI Ready Datacenters, the 20ft Cold Plate Rackmount CDU Data Center Container solves these pain points in a single, integrated package. Unlike fragmented cooling setups, this 20ft container uses a centralized rackmount CDU design with cold plate liquid cooling at its core—eliminating the need for complex airflow management, raised floors, or server fans that eat up energy and limit AI performance.
By leveraging rackmount CDU-driven cold plate technology, coolant is delivered directly to AI hardware (GPUs, compute nodes) via precision cold plates, capturing heat efficiently from high-density components—keeping chips cool even under the heaviest AI training loads. This self-contained 20ft solution is easy to deploy, scalable, and optimized for AI workloads, turning any location into a high-performance AI Ready Datacenter without compromising on reliability or energy efficiency.
| Model | Cooling Architecture | Rack / Tank Count | Max Power Density | Total Capacity | Container Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| 20ft Immersion › | Single-Phase Immersion (Integrated FDU) |
4 Tanks | 100 kW / Tank | 400 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
| 40ft Immersion › | Single-Phase Immersion (Integrated FDU) |
12 Tanks | 100 kW / Tank | 1.2 MW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (In-Row) › | In-Row CDU (Liquid-to-Liquid / Air Assist) |
12 Racks (Space for CDUs) |
60 kW / Rack | 720 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
14 Racks (Maximized Space) |
50 kW / Rack | 700 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 20ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
5 Racks | 50 kW / Rack | 250 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
Immersion cooling eliminates the energy drain of server fans and inefficient air-cooling systems—liquid transfers heat far more effectively than air, cutting overall energy use significantly compared to standard air-cooled containers. For AI-ready data centers, this means lower operational costs (OPEX) for running power-hungry GPU clusters, while also reducing the carbon footprint of large-scale LLM training workloads.
The sealed immersion tank design shields valuable AI hardware from dust, humidity, and environmental contaminants—critical for deployments in non-traditional data center locations. More importantly, the stable, consistent thermal environment keeps AI chips running at full speed without thermal throttling, maximizing compute performance and hashrate for LLM training and other high-density AI workloads.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
