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AI Ready Data Center
Created with Pixso. ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft

ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft

Brand Name: Soeteck
Model Number: SYICDC40
MOQ: 1
Price: To Be Negotiated
Delivery Time: 5-10 Weeks
Payment Terms: D/A
Detail Information
Place of Origin:
China
Certification:
CE, ISO, UL
Deployment Time:
5-10 Weeks
Rack Quantity:
4/9/12 Pcs
Single Rack Capacity:
42U
Single Rack Max. Capacity:
50/60/100kW
Power Sypply:
On Demand
Cooling Type:
Liquid Cooling/Air Cooling/Water Cooling/Chilled Water
Rack Dimensions (W*D*H):
600*1100*2000mm
Applications:
AI Training, Edge Computing, Remote Sites, Disaster Recovery
Monitoring System:
Yes
Door Security System:
Yes
EPO:
Yes
Video Monitoring System:
Yes
Packaging Details:
20/40ft High Cube Container
Supply Ability:
10000/Month
Highlight:

ODM AI Ready Data Center

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Liquid Cooling AI Ready Data Center

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40ft data center infrastructure

Product Description

Deploying large-scale, homogeneous AI clusters (such as NVIDIA HGX/DGX pods) requires a cooling architecture that is both highly efficient and streamlined. Managing hundreds of individual cooling loops in a dense AI-ready data center environment can become an operational headache if not centralized—especially for the demanding thermal needs of AI training and inference workloads.

Optimized for these uniform high-performance AI-ready environments, the 40ft ODM Cold Plate Liquid Cooling Data Center Container for AI-Ready Data Centers offers a centralized "Hybrid Cooling" architecture. It simplifies facility management while delivering precise thermal control to high-density AI racks without the complexity of distributed components, embodying the customizable ODM advantage for tailored AI data center deployments.

By employing powerful Cold Plate Liquid Cooling technology (the core of this 40ft ODM AI-ready data center container), it creates an efficient secondary loop managing heat from 12 racks simultaneously. It directs liquid coolant to AI processors via cold plates (Direct-to-Chip) while integrated air handlers manage residual heat, creating an ideal turnkey ODM solution for standardized, high-density AI training and workload deployment.


Product Family

Model Cooling Architecture Rack / Tank Count Max Power Density Total Capacity Container Type Dimensions (L*W*H)
20ft Immersion Single-Phase Immersion
(Integrated FDU)
4 Tanks 100 kW / Tank 400 kW 20ft High Cube 6058 x 2438 x 2896 mm
40ft Immersion Single-Phase Immersion
(Integrated FDU)
12 Tanks 100 kW / Tank 1.2 MW 40ft High Cube 12192 x 2438 x 2896 mm
40ft Cold Plate (In-Row) In-Row CDU
(Liquid-to-Liquid / Air Assist)
12 Racks
(Space for CDUs)
60 kW / Rack 720 kW 40ft High Cube 12192 x 2438 x 2896 mm
40ft Cold Plate (Rack) Rack-Mounted CDU
(Distributed Manifold)
14 Racks
(Maximized Space)
50 kW / Rack 700 kW 40ft High Cube 12192 x 2438 x 2896 mm
20ft Cold Plate (Rack) Rack-Mounted CDU
(Distributed Manifold)
5 Racks 50 kW / Rack 250 kW 20ft High Cube 6058 x 2438 x 2896 mm

Product Features

ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 0

Centralized N+1 Redundancy

Large-capacity In-Row CDUs operate in redundancy, ensuring continuous coolant flow to all racks even during pump maintenance. This centralized approach simplifies the piping network and reduces overall maintenance points.


Smart Leak Mitigation

The system utilizes a negative pressure or leak-safe design in the secondary loop, combined with distributed leak sensing tape along the manifolds to ensure instant detection and isolation, protecting your critical assets.

ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 1

Full Series OF AI Ready DATA CENTER SOLUTIONS


Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.

5-30 kW per Cabinet

Cold Aisle Data Center

Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.

10-80 kW Total Power

20ft Container DC

Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.

30-100 kW per Cabinet

40ft Cold Plate Container DC

Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.

50-200 kW per Cabinet

40ft Immersion Container DC

Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.

APPLICATIONS


Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.

ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 6
AI Training & HPC Clusters
ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 7
High-Density Data Centers
ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 8
Modular & Container Solutions
ODM Cold Plate Liquid Cooling AI Ready Data Center Infrastructure 40ft 9
Blockchain & Crypto Mining

FAQ


1. What defines a data center as "AI-Ready"?
An AI-Ready data center is engineered for extreme power density and thermal management. It features reinforced floor loading for heavy GPU clusters, high-voltage power distribution (such as 415V or 480V) to the rack, and a flexible cooling architecture capable of supporting 40kW to 100kW+ per cabinet.
2. How does the infrastructure support high-performance networking (RDMA)?
Our AI-Ready modules are designed with specialized overhead cable management systems to handle the high-density fiber counts required for InfiniBand and RoCE networks. We ensure optimized cable path lengths to minimize latency and maintain the strict bend radii necessary for 400G and 800G optical interconnects.
3. Can your AI-Ready racks support liquid cooling for NVIDIA Blackwell or H100 systems?
Yes. Our racks are pre-configured for liquid-to-chip cooling. They feature integrated manifolds and space for Coolant Distribution Units (CDUs), making them fully compatible with the high thermal design power (TDP) requirements of the latest NVIDIA Blackwell and Hopper architectures.
4. How do you handle the massive power surges associated with AI training loads?
AI workloads create highly variable power demands. Our solutions utilize intelligent PDUs and UPS systems with high-discharge batteries or flywheels that can handle rapid "step-loads," ensuring electrical stability even when thousands of GPUs ramp up to full power simultaneously.
5. Are these modules scalable for rapid "Day 2" expansions?
Absolutely. We use a modular "building block" design. You can start with a few high-density AI pods and add more as your compute needs grow. The cooling and power hookups are standardized for rapid deployment, reducing the "Ready-for-Service" time by up to 30% compared to traditional builds.
6. What is the maximum rack weight capacity for fully loaded AI servers?
Our AI-specific cabinets are built with heavy-gauge reinforced steel, supporting a static load rating of up to 2,200kg (approx. 4,850 lbs). This safely accommodates full-stack AI configurations, including internal bus bars, liquid manifolds, and multi-node GPU systems.
7. How does AI-readiness impact the sustainability (PUE) of the facility?
AI-Ready centers actually improve efficiency by moving cooling closer to the heat source. By utilizing Rear Door Heat Exchangers (RDHx) or Direct Liquid Cooling (DLC), we can remove heat more efficiently than traditional air-only methods, targeting a PUE of 1.12 or lower even at 100kW per rack densities.

Have more questions about our Liquid Cooling Solutions?

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