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| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
The exponential growth of Large Language Models (LLMs) has pushed chip thermal design power (TDP) beyond the physical limits of air cooling. Hyperscale operators face a "thermal wall" where traditional cooling consumes too much energy and space to support next-generation GPU clusters efficiently, creating an urgent demand for advanced cooling solutions tailored for AI ready data centers.
Breaking through this barrier requires a fundamental shift in physics. The 40ft Immersion Cooling Modular Data Center Container For AI Ready Data Center is engineered specifically for the hyperscale era, serving as a megawatt-class infrastructure solution designed to fit within a standard logistics footprint, and it is perfectly optimized to meet the stringent thermal and operational requirements of AI ready data centers.
Housing up to 12 high-capacity immersion tanks, this AI-centric modular data center container delivers a massive total capacity of 1.2 MW. It features a fully integrated secondary cooling loop with redundant pump groups and adiabatic dry coolers. By ensuring every transistor stays within its optimal thermal envelope, it unlocks the full potential of high-performance AI chipsets while reducing the facility's carbon footprint by up to 40%, making it a pivotal and sustainable infrastructure choice for building and scaling AI ready data centers.
| Model | Cooling Architecture | Rack / Tank Count | Max Power Density | Total Capacity | Container Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| 20ft Immersion › | Single-Phase Immersion (Integrated FDU) |
4 Tanks | 100 kW / Tank | 400 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
| 40ft Immersion › | Single-Phase Immersion (Integrated FDU) |
12 Tanks | 100 kW / Tank | 1.2 MW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (In-Row) › | In-Row CDU (Liquid-to-Liquid / Air Assist) |
12 Racks (Space for CDUs) |
60 kW / Rack | 720 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
14 Racks (Maximized Space) |
50 kW / Rack | 700 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 20ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
5 Racks | 50 kW / Rack | 250 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
This 40ft modular container supports unprecedented power densities, housing multiple high-capacity immersion tanks to reach megawatt-level compute power. By consolidating massive AI GPU clusters into a single mobile footprint, it drastically reduces land requirements and site preparation time compared to traditional brick-and-mortar data centers.
The integrated closed-loop cooling architecture utilizes advanced dry cooler technology, consuming zero water for heat rejection. This makes our 40ft immersion container the ideal ESG-compliant choice for water-scarce regions, while the automated dielectric fluid management system ensures continuous, high-performance operation for AI training without environmental impact.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
