|
| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
AI training clusters and high-performance computing (HPC) systems push hardware to its thermal limits—standard data center cooling simply can’t keep up with the intense heat from dense GPU racks, especially in edge computing scenarios where space and infrastructure are constrained. The 24 Cabinet OEM HPC Cold Aisle Containment Data Center for Edge Computing is built specifically for this challenge, a purpose-designed solution that keeps critical HPC and AI hardware cool while adapting to the evolving cooling needs of next-gen LLM training, scientific computing, and edge-based high-density workloads.
Unlike basic cold aisle containment, this edge-optimized OEM system supports hybrid cooling setups—seamlessly combining traditional precision air cooling with direct-to-chip liquid cooling as your HPC GPU clusters grow. It’s engineered to handle the heavy weight and high heat output of HPC servers, with reinforced structural support and purpose-built pathways for coolant distribution. This 24-cabinet OEM solution delivers the reliability mission-critical edge HPC facilities need, serving as a stable foundation for scaling large language model training and high-density edge computing workloads.
| Configuration | IT Cabinets | Power / Cab | UPS System | Cooling Capacity | Refrigeration Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| Plan 1 › | 12 Cabinets | 5 kW | 90K Rack Modular (15kVA modules, 4+1) |
25.5kW x 4 (3+1 Redundancy) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 2 › | 12 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
65.5kW x 2 (1+1 Redundant) |
In-Row AC | 4800 x 3600 x 2000 mm |
| Plan 3 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
71.1kW x 1 (N Redundancy) |
Room-Level AC | 4800 x 3600 x 2000 mm |
| Plan 4 › | 14 Cabinets | 5 kW | 120K Tower Modular (30kVA modules, 3+1) |
Custom Capacity (Tailored) |
FAN WALL | 4800 x 3600 x 2000 mm |
| Plan 5 › | 18 Cabinets | 5 kW | Modular N+1 (25kVA modules, 4+1) |
31.1kW x 4 (3+1 Redundancy) |
In-Row AC | 6000 x 3600 x 2000 mm |
| Plan 6 › | 24 Cabinets | 5 kW | Modular N+1 (25kVA modules, 5+1) |
40.9kW x 4 (3+1 Redundancy) |
In-Row AC | 8400 x 3600 x 2000 mm |
| Custom › | ≤ 48 Cabinets | ≤ 15 kW | Max 500kVA (2N/N+1 Redundancy) |
Flexible Capacity (Row or Room) |
Air / Water / Chilled | Length ≤ 15000 mm |
This 12-cabinet cold aisle system is built to work with both chilled water and direct-to-chip liquid cooling—no full redesign needed as you upgrade to higher-density GPU clusters. It comes with pre-reserved space for coolant distribution units (CDUs) and manifolds, letting you transition from air cooling to hybrid cooling seamlessly. This future-proof design means your cold aisle grows with your AI hardware, avoiding costly overhauls down the line.
Unlike rigid, one-size-fits-all containment systems, this 12-cabinet solution can be customized to fit irregular room shapes or existing support pillars—adapting to your data center’s unique layout, not the other way around. It’s reinforced to support the heavy weight of power-hungry AI servers, with redundant power delivery that keeps your LLM training workloads running nonstop. This flexibility and reliability make it ideal for scaling AI-ready data centers without disrupting ongoing operations.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
