|
| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 Weeks |
| Payment Terms: | D/A |
The 20ft Liquid Cooling Mobile Data Center Container Solutions (42U, 100kW) is built for this exact challenge: a compact, logistics-friendly mobile solution that fits into standard shipping and deployment workflows, while offering robust 100kW cooling capacity tailored to high-density AI and HPC compute needs. Unlike rigid, one-size-fits-all cooling setups, this 20ft mobile container adapts to your AI cluster’s unique requirements with a 42U rack configuration, no matter the scale of your LLM or high-performance computing (HPC) workloads.
By leveraging advanced liquid cooling technology to pull heat away from chips far more efficiently than air cooling—ensuring every transistor runs at its optimal temperature, even under extreme 100kW AI workloads—this system delivers uncompromised performance. The fully integrated closed-loop liquid cooling design slashes energy waste and carbon footprint, while the 20ft mobile container’s 42U rack layout and scalable 100kW capacity mean you can deploy precisely the cooling and compute support you need, now and as your AI and HPC needs grow.
| Model | Cooling Architecture | Rack / Tank Count | Max Power Density | Total Capacity | Container Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| 20ft Immersion › | Single-Phase Immersion (Integrated FDU) |
4 Tanks | 100 kW / Tank | 400 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
| 40ft Immersion › | Single-Phase Immersion (Integrated FDU) |
12 Tanks | 100 kW / Tank | 1.2 MW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (In-Row) › | In-Row CDU (Liquid-to-Liquid / Air Assist) |
12 Racks (Space for CDUs) |
60 kW / Rack | 720 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
14 Racks (Maximized Space) |
50 kW / Rack | 700 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 20ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) |
5 Racks | 50 kW / Rack | 250 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
The 20ft container footprint packs exceptional compute density into a compact, transportable space—far more than traditional data center halls can offer in the same area. Its fully customizable layout lets you adjust the number and configuration of immersion tanks to match your exact GPU/AI cluster needs, whether you’re running small-scale LLM training or scaling up to larger workloads. This flexibility eliminates over-provisioning and keeps deployment fast and cost-effective.
Unlike water-intensive cooling systems, our closed-loop dry cooler design uses zero water for heat rejection—making it an ideal choice for regions facing water scarcity or strict environmental regulations. The integrated fluid management system maintains the dielectric strength of the immersion fluid 24/7, ensuring uninterrupted operation and protecting your valuable computing hardware. This eco-friendly approach cuts both water usage and energy costs, while keeping chips running at peak performance.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
